The college relies on the Sichuan Provincial Key Laboratory of Meteorological Information and Signal Processing, as well as the Sichuan Provincial Collaborative Innovation Center for Integrated Computing and Chip Security, to carry out scientific research in the fields of communication, computer science, and microelectronics. The college currently has research teams that include:

· RF Wireless Communication Testing

· Intelligent Communication and Information Processing

· Mobile Applications and Services

· RF Millimeter Wave Integrated Circuit Design

· Cluster Intelligent Sensing and Communication Systems

· Microwave RF Modules and Advanced Packaging of Microsystems

· Complex Information Processing and Intelligent Algorithms

· Sensor and Digital System Design

· Satellite/Wireless Communication Reliable Transmission and Intelligent Sensing

· Intelligent Sensing Microsystems

    The college possesses various RF testing equipment below 67GHz, which can achieve rapid simulation and evaluation from concepts, algorithms, and components to systems. The research team has been dedicated to developing equipment and products needed for industry applications and local economic development in electronic communication and information systems, achieving significant results. They have developed the first nationwide 24-channel automatic reporting system put into business operation; solved the problem of reliable transmission of information for wireless communication in typhoon and heavy rain areas, achieving multiplexing of data and voice; developed and exported a military command and control data processing system (CDPS); created a networked wireless spectrum reconnaissance system with a frequency coverage of up to 6GHz; developed an ultra-high-speed RapidIO system for critical data storage; produced a 6W solid-state integrated power amplifier for millimeter waves, an 8mm radar transceiver front-end and microwave components, a Beidou first and second generation navigation transceiver, a 900MHz ISO18000-6c RFID reader; designed digital TV transceiver chips, 2.5-3.0GHz universal broadband modulators, multi-channel wireless LAN 802.11a/b/g transceiver front-end chips, plastic optical fiber transceiver chips, 3G multi-standard broadband transceiver chips, ground-based and airborne phased array radar T/R chips, as well as various RF chips for the Beidou first generation and 5W power amplifier chips, all of which have been put into practical use.