Name：Jing Li

Degrees: Doctor

Title：Lecturer

Department：Microeletronics

Research interests：Integrated Circuit Packaging

Research team：Rf microwave circuit and microsystem packaging

E-mail：lijing1@cuit.edu.cn

【Biography】

Li Jing, female, lecturer, PhD degree. In recent years, she has published more than 10 papers in high-level journals and important academic conferences, among which 5 papers are included in SCI. As a major participant, she participated in a number of national longitudinal research projects, such as National Natural Science Foundation projects. She is A professional reviewer of international SCI journals such as Advanced Materials Interfaces and Sensors and Physical qualifications.

【Courses &Teaching】

《Integrated Circuit Package and Testing》，《VerilogHDL Digital System Design》

【Publications & Presentations】

1. Jing Li, Hai Nie, Guoyun Zhou, et al. High-resolution temperature sensor fabricated with composed PEDOT: PSS/CuPc for electronic skin[J]. Sensors and Actuators A-Physical, 2023, 363: 114706.

2. Jing Li, Guoyun Zhou, Yan Hong, et al. Highly sensitive, flexible and wearable piezoelectric motion sensor based on PT promoted β-phase PVDF[J]. Sensors and Actuators A-Physical, 2022, 37: 113415.

3. Jing Li, Guoyun Zhou, Yan Hong, et al. A catalytic interfacing PEDOT: PSS/CuPc polymerized on cloth fiber to electro-metalize stretchable copper conductive pattern[J]. Advanced Materials Interfaces, 2021, 2101462.

4. Jing Li, Guoyun Zhou, Yan Hong, et al. Copolymer of pyrrole and 1,2-butanediol diglycidyl as an efficient additive leveler for through-hole copper electroplating[J]. ACS Omega, 2020, 5: 4868-4874.

5. Jing Xiang, Shouxu Wang, Jing Li, et al. Electrochemical factors of leverlers on plating uniformity of through-holes: simulation and experiments[J]. Journal of The Electrochemical Society, 2018, 165(9): E359-E365.

6. Zhihua Tao, Wei He, Jing Li, et al. Texraoxa-diphosphaspiro derivative as suppressor for microvia filling by copper electroplating in acidic solution[J]. Journal of The Electrochemical Society, 2017, 164(14): D1032-D1041.

7. Li Zheng, Chong Wang, Jing Li, et al. Investigation of benzoquinone as a new type of Cu electroplating additive[C]. 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2017: 231-233.

【Awards】

1. 2019, the Second prize of Science and Technology Progress of the Ministry of Education, Key technologies and applications of special electronic chemicals for electronic circuit interconnection